ReflowCoach®

Instructions: Enter data from an existing oven profile (time and temperature readings) into the appropriate blue cells. Note the grey temperature cells at 175o, 183o, and 183oC. Time readings must be entered at these temperatures to calculate time-above-liquidus (TAL) and to evaluate whether or not the Lee Dwell Criteria1 has been met. If the user enters data for tunnel length, belt speed, product length, and product spacing into the appropriate blue cells, ReflowCoach® calculates the throughput and profile time in the grey cells as shown in Figure 1. A grey cell also shows if the Lee Dwell Criteria (<0.25oC/s for 40 seconds) has been met.

1 Lee, Ning-Cheng, Reflow Soldering Processes and Troubleshooting, pg. 243, Newnes, Boston 2002
Solder Paste Specification

Ramp to Dwell

 

Ramp Down

 

Ramp-to-Peak

Throughput Calculator

Inputs

 

Outputs

 

Lee Dwell Criteria

Inputs

Time (s)

 

Temperature (oC)

Calculations

Room Temp to 183oC

 

Ramp Down

 

Time-Above-Liquidus

ReflowCoach® Graphs